Fabrication method of substrate

ABSTRACT

A fabricating method of a substrate board is provided. The substrate board includes a substrate having rigid areas and flexible areas, and at least an electronic component disposed on the substrate, wherein each of the rigid areas is thicker than the flexible areas. A patterned high-extensive material may be additionally disposed on the substrate to improve reliability thereof. The rigid areas and the flexible areas may be formed by molds or cutters. By using an above structure, the electronic component is less affected when the substrate is under stress, so that good characteristics are maintained.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a divisional application of and claims prioritybenefit of an U.S. application Ser. No. 12/424,536, filed on Apr. 15,2009, now allowed. This application also claims the priority benefit ofTaiwan application serial no. 97148842, filed Dec. 15, 2008. Theentirety of the above-mentioned patent application is herebyincorporated by reference herein and made a part of specification.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a substrate board. More particularly,the present invention relates to a flexible substrate board, afabrication method thereof and a display using the same.

2. Description of Related Art

For a flexible electronic product or a flexible display, components suchas electronic components with stable characteristics therein areindispensable. However, regardless of fabricating by a high-extensive ora low-ductility material, after the electronic device is elongated for along time, it can be cracked due to an elastic fatigue thereof. Suchphenomenon is a great problem for applications of the flexibleelectronic product and the flexible display.

Presently, a solution of the above problem is based on a materialsubstitution method. For example, a material with high ductility isapplied to the electronic device to slow down a shifting of thecharacteristic of the electronic device during the elongation process.According to the above material substitution method, a silicon materialis, for example, substituted by an organic semiconductor, silicon oxideor silicon nitride is substituted by an organic insulation layer, and avacuum thin-film process is substituted by a metal solution process,etc. However, the characteristic of the electronic device is stillslowly changed during the elongation process and cannot be stable, sothat a solution thereof is still required.

A U.S. Patent No. 2006/0204675 discloses a method to implement a rigidarea and a flexible area by combining different materials. Referring toFIG. 1A, FIG. 1A is a cross-sectional view of a flexible substrate boardfabricated according to the U.S. Patent No. 2006/0204675. The substrateboard 100 is composed of different materials, and includes a rigid area110 composed by a rigid material and a flexible area 120 composed by aflexible material, wherein a pixel 130 is disposed on the rigid area110. Such substrate is fabricated by using a coextrusion roller. FIG. 1Bis a schematic diagram of the coextrusion roller. First, a manifold 140provides a multi-section layer 150 having the rigid area 110 and theflexible area 120 shown in FIG. 1A. The multi-section layer 140 isextruded by rollers 160, 162 and 164 and is combined to a substrate 170having the pixel 130 or other circuit devices to form the aforementionedflexible substrate board. According to such method, the flexiblecharacteristic of the substrate board can be achieved base on adifference of the material characteristics. However, during theextrusion process, the devices on the substrate 170 have to beaccurately aligned to the rigid area 110 or the flexible area 120 withtotally different characteristics, which may lead to a great difficultyfor the fabrication process. Therefore, the method is not widelyapplied.

Moreover, a U.S. Patent No. 2008/0002118 and a U.S. Patent No.2008/0053604 respectively disclose a flexible substrate board, in whicha substrate and a flexible substrate are combined according to a gluingmethod, so as to achieve the flexibility.

In addition, a U.S. Patent No. 2005/0259189, a U.S. Patent No.2007/0052670, a U.S. Patent No. 2006/0132025 and a U.S. Pat. No.6,710,841 respectively disclose a flexible substrate board, in which theflexibility is achieved based on the difference of the materialcharacteristics or a difference of thickness of a plurality ofsubstrates.

In the aforementioned related techniques, different materials withdifferent characteristics are applied to, achieve the flexibility of thesubstrate board, which all have difficulties and problems inapplication.

SUMMARY OF THE INVENTION

The present invention is directed to a substrate board, which canachieve a flexible characteristic according to a structural differenceby using a same material.

The present invention provides a substrate board including at least arigid area and at least a flexible area, wherein the rigid area isthicker than the flexible area. When the substrate board is bended, theflexible area has a relatively great deformation due to its relativelyweak mechanical strength, and the rigid area has a relatively smalldeformation, so that better characteristics of device areas and displayareas can be maintained.

The present invention provides a method for fabricating a substrateboard, which can be used to fabricate the aforementioned substrateboard. In an embodiment, the method can be described as follows. First,a substrate layer is provided. Next, after the substrate layer ispatterned, a substrate including at least a rigid area and at least aflexible area is formed, wherein, the rigid area is thicker than theflexible area. Finally, components are fabricated on the rigid area ofthe substrate.

The substrate board provided by the present invention can be applied toa display, wherein the display includes a plurality of pixel areas and aplurality of lead areas, the lead areas are connected to thecorresponding pixel areas according to configurations thereof, and areconnected to an external signal source for transmitting signals to thecorresponding pixel areas to display images. The pixel areas and thelead areas are disposed on a substrate according to a layout, whereinthe substrate includes at least a rigid area and at least a flexiblearea, and the rigid area is thicker than the flexible area. In anembodiment, the pixel areas are disposed in the rigid area, and the leadareas are disposed in the flexible area.

In order to make the aforementioned and other objects, features andadvantages of the present invention comprehensible, a preferredembodiment accompanied with figures is described in detail below.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings are included to provide a furtherunderstanding of the invention, and are incorporated in and constitute apart of this specification. The drawings illustrate embodiments of theinvention and, together with the description, serve to explain theprinciples of the invention.

FIG. 1A is a cross-sectional view of a flexible substrate boardfabricated according to a U.S. Patent No. 2006/0204675.

FIG. 1B is a schematic diagram of a coextrusion roller according to aU.S. Patent No. 2006/0204675.

FIG. 2A to FIG. 2E are cross-sectional views illustrating a fabricationflow of a substrate board according to an embodiment of the presentinvention.

FIG. 3A to FIG. 3E are cross-sectional views illustrating a fabricationflow of a substrate board according to an embodiment of the presentinvention.

FIG. 4A to FIG. 4E are cross-sectional views illustrating a fabricationflow of a substrate board according to an embodiment of the presentinvention.

FIG. 4F is a cross-sectional view of a substrate board according to anembodiment of the present invention.

FIG. 5A to FIG. 5D are cross-sectional views illustrating a fabricationflow of a substrate board according to an embodiment of the presentinvention.

FIG. 6A to FIG. 6D are cross-sectional views illustrating a fabricationflow of a substrate board according to an embodiment of the presentinvention.

FIG. 7A to FIG. 7C are cross-sectional views illustrating a fabricationflow of a substrate board according to an embodiment of the presentinvention.

FIG. 8A to FIG. 8D are cross-sectional views illustrating a fabricationflow of a substrate board according to an embodiment of the presentinvention.

FIG. 9A to FIG. 9D are cross-sectional views illustrating a fabricationflow of a substrate board according to an embodiment of the presentinvention.

FIG. 10 is a cross-sectional view of a substrate board according to anembodiment of the present invention.

FIG. 11A to FIG. 11D are respectively cross-sectional views of asubstrate board according to an embodiment of the present invention.

FIG. 12A and FIG. 12B are respectively cross-sectional views of asubstrate according to an embodiment of the present invention.

FIG. 13 is a top view of a substrate board according to an embodiment ofthe present invention.

FIG. 14A and FIG. 14B are respectively top views of a substrate boardaccording to an embodiment of the present invention.

FIG. 15A to FIG. 15D are respectively top views of a substrate boardaccording to an embodiment of the present invention.

DESCRIPTION OF EMBODIMENTS

The present invention provides a substrate board, which can achieve aflexible characteristic according to a structural difference. Since theflexible characteristic is achieved by meliorating a structure of thesubstrate board, and is not achieved by applying components withextensibility, variation of characteristics of the components due toelastic fatigues after the substrate board is elongated for a long timecan be avoided, or even malfunction of the whole device due to crack ofthe components can be avoided.

The substrate board provided by the present invention includes at leasta rigid area and at least a flexible area, wherein the rigid area isthicker than the flexible area. When the substrate board is bended, theflexible area has a relatively great deformation due to its relativelyweak mechanical strength, and the rigid area has a relatively smalldeformation, so that better characteristics of device areas and displayareas can be maintained.

The substrate board provided by the present invention can be formed byone or more flexible materials, and a formation thereof can be asingle-layer structure or a multi-layer stacked structure in a verticalor a horizontal direction.

The present invention provided a flexible display applying theaforementioned substrate board, in which the device areas and thedisplay areas can be disposed on the rigid area and lead areas can bedisposed on the flexible region. Therefore, when the substrate board isbended, the flexible area has a relatively great deformation due to itsrelatively weak mechanical strength, and the rigid area has a relativelysmall deformation, so that the characteristics of the device areas andthe display areas are not liable to be influenced when the substrateboard is bended.

Therefore, according to the above design, an influence of stressesgenerated when the substrate board is bended can be greatly reduced. Astress interface can be design to be progressive, such as an arcdistribution, a trapezoid distribution, a triangle distribution or avertical distribution. The rigid area and the flexible area of thesubstrate board can be implemented by applying the same material withdifferent thickness, so that application of a rigid material on thesubstrate board to increase a rigidity of the rigid area is unnecessary.Moreover, a patterned high-extensive material layer can be added to thesubstrate board to reinforce the flexible area probably having a problemof poor reliability due to a thin thickness thereof, and maintain anexistence of the rigid area and the flexible area.

Besides, the present invention provides a method for fabricating theaforementioned substrate board. In the present embodiment, at least arelatively thick area and at least a relatively thin area are formed ona flexible substrate board, wherein the relatively thick area is therigid area, and the relatively thin area is the flexible area. A methodof forming the relatively thick area and the relatively thin area is,for example, to cut a surface of the substrate by a cutter, or therelatively thick area and the relatively thin area can be formed througha patterning process during fabrication of the substrate board, or bothof the above methods can be alternately used. Moreover, the patternedhigh-extensive material layer can be added to the substrate board toimprove a reliability of the substrate board.

Embodiments are provided below to describe a flowchart for fabricatingthe substrate board of the present invention.

FIG. 2A to FIG. 2E are cross-sectional views illustrating a fabricationflow of a substrate board according to an embodiment of the presentinvention.

First, referring to FIG. 2A, a base 210 is provided, and a materiallayer 220 is formed on the base 210. Next, referring to FIG. 2B, thematerial layer 220 is patterned to form a patterned material layer 222,wherein a material of the material layer 220 can be an inorganicmaterial or an organic material. Next, referring to FIG. 2C, a substrate230 is disposed on the patterned material layer 222, and electroniccomponents 240 and 242 are fabricated on the substrate 230, as shown inFIG. 2D. Finally, referring to FIG. 2E, the substrate 230 is separatedfrom the base 210 and the patterned material layer 222 to form asubstrate board 200.

Now, the substrate 230 of the substrate board 200 includes at least arelatively thick area and at least a relatively thin area, so that adesign of sharing the stress by different thickness is achieved. Therelatively thick area of the substrate 230 is the rigid area, and therelatively thin area is the flexible area, wherein the relatively thickarea is at least twice the thicker than the relatively thin area.

In the present embodiment, the material layer 220 is not necessarilypatterned on the base 210, but can also be patterned first to form thepatterned material layer 222, and then the patterned material layer 222is disposed on the base 210.

In the present embodiment, a sequence of the step of fabricating theelectronic device 240 and 242 on the substrate 230 and the step ofseparating the substrate 230 from the base 210 and the patternedmaterial layer 222 can be exchanged.

In the present embodiment, the substrate board 200 includes theelectronic components 240 and 242, though the present invention is notlimited thereto, and more or less electronic components can also beincluded.

FIG. 3A to FIG. 3E are cross-sectional views illustrating a fabricationflow of a substrate board according to an embodiment of the presentinvention.

First, referring to FIG. 3A, a base 310 is provided, and a materiallayer 320 is formed on the base 310. Next, referring to FIG. 3B, thematerial layer 320 is patterned to form a patterned material layer 322,wherein a material of the material layer 320 can be an inorganicmaterial or an organic material. Next, referring to FIG. 3C, a substrate330 is disposed on the patterned material layer 322, and electroniccomponents 340 and 342 are fabricated on the substrate 330, as shown inFIG. 3D. Finally, referring to FIG. 3E, the substrate 330 is separatedfrom the base 310 and the patterned material layer 322 to form asubstrate board 300.

Now, the substrate 330 of the substrate board 300 includes at least arelatively thick area and at least a relatively thin area, so that adesign of sharing the stress by different thickness is achieved. Therelatively thick area of the substrate 330 is the rigid area, and therelatively thin area is the flexible area, wherein the relatively thickarea is at least twice the thicker than the relatively thin area.

In the present embodiment, the material layer 320 is not necessarilypatterned on the base 310, but can also be patterned first to form thepatterned material layer 322, and then the patterned material layer 322is disposed on the base 310.

In the present embodiment, a sequence of the step of fabricating theelectronic device 340 and 342 on the substrate 330 and the step ofseparating the substrate 330 from the base 310 and the patternedmaterial layer 322 can be exchanged.

In the present embodiment, the substrate board 300 includes theelectronic components 340 and 342, though the present invention is notlimited thereto, and more or less electronic components can also beincluded.

FIG. 4A to FIG. 4E are cross-sectional views illustrating a fabricationflow of a substrate board according to an embodiment of the presentinvention.

First, referring to FIG. 4A, a base 410 is provided, and a substrate 430is formed on the base 430. Next, referring to FIG. 4B, electric devices440 and 442 are fabricated on the substrate 430. Next, the substrate 430is separated from the base 410, as shown in FIG. 4C. Finally, referringto FIG. 4D, a cutter 450, for example, a laser emitter or a blade isapplied to cut a surface of the substrate 430 to form a relatively thickarea and a relatively thin area thereon, so as to achieve a design ofsharing the stress by different thickness, and form a substrate board400, as shown in FIG. 4E. Wherein, the relatively thick area of thesubstrate 430 is the rigid area, and the relatively thin area is theflexible area, and the relatively thick area is at least twice thethicker than the relatively thin area.

Moreover, in the present embodiment, a patterned high-extensive materiallayer 460 can be additionally disposed on the cut surface of thesubstrate 430, as shown in FIG. 4F, so as increase the reliability ofthe substrate board 400. A material of the patterned high-extensivematerial layer 460 is, for example, polyurethane, polysiloxane,polydimethylislioxane, ether-containing materials series, polyolefin orcombinations thereof. Moreover, the patterned high-extensive materiallayer 460 can be only disposed on the flexible area.

In the present embodiment, a sequence of the step of fabricating theelectronic components 440 and 442 on the substrate 430 and the step ofcutting the surface of the substrate 430 can be exchanged. Moreover, thestep of cutting the surface of the substrate 430 can be first performed,and then the step of disposing the patterned high-extensive materiallayer 460 is performed, and finally the step of fabricating theelectronic components 440 and 442 on the substrate 430 is performed.

In the present embodiment, the substrate board 400 includes theelectronic components 440 and 442, though the present invention is notlimited thereto, and more or less electronic components can also beincluded.

FIG. 5A to FIG. 5D are cross-sectional views illustrating a fabricationflow of a substrate board according to an embodiment of the presentinvention.

First, referring to FIG. 5A, a base 510 is provided. Next, a patternedhigh-extensive material layer 560 is formed on the base 510, and thepatterned high-extensive material layer 560 has at least an indentationarea. A material of the patterned high-extensive material layer 560 is,for example, polyurethane, polysiloxane, polydimethylislioxane,ether-containing materials series, polyolefin or combinations thereof.Next, referring to FIG. 5B, a substrate 530 is disposed on the patternedhigh-extensive material layer 560, wherein the substrate 530 can be onlydisposed in the indentation area of the patterned high-extensivematerial layer 560. Next, referring to FIG. 5C, electronic components540 and 542 are fabricated on the substrate 530. Finally, the substrate530 and the patterned high-extensive material layer 560 are separatedfrom the base 510 to form a substrate board 500, as shown in FIG. 5D.

Now, the substrate 530 of the substrate board 500 includes at least arelatively thick area and at least a relatively thin area, so that adesign of sharing the stress by different thickness is achieved. Therelatively thick area of the substrate 530 is the rigid area, and therelatively thin area is the flexible area, wherein the relatively thickarea in the substrate 530 is at least twice the thicker than therelatively thin area.

In the present embodiment, the high-extensive material layer is notnecessarily patterned on the base 510, but can also be patterned firstto form the patterned high-extensive material layer 560, and then thepatterned high-extensive material layer 560 is disposed on the base 510.

In the present embodiment, the substrate board 500 includes theelectronic components 540 and 542, though the present invention is notlimited thereto, and more or less electronic components can also beincluded.

FIG. 6A to FIG. 6D are cross-sectional views illustrating a fabricationflow of a substrate board according to an embodiment of the presentinvention.

First, referring to FIG. 6A, a base 610 is provided. Next, a patternedhigh-extensive material layer 660 is formed on the base 610, and thepatterned high-extensive material layer 660 has at least an indentationarea. A material of the patterned high-extensive material layer 660 is,for example, polyurethane, polysiloxane, polydimethylislioxane,ether-containing materials series, polyolefin or combinations thereof.Next, referring to FIG. 6B, a substrate 630 is disposed on the patternedhigh-extensive material layer 660, wherein the substrate 630 can be onlydisposed in the indentation area of the patterned high-extensivematerial layer 660. Next, referring to FIG. 6C, electronic components640 and 642 are fabricated on the substrate 630. Finally, the substrate630 and the patterned high-extensive material layer 660 are separatedfrom the base 610 to form a substrate board 600, as shown in FIG. 6D.

Now, the substrate 630 of the substrate board 600 includes at least arelatively thick area and at least a relatively thin area, so that adesign of sharing the stress by different thickness is achieved. Therelatively thick area of the substrate 630 is the rigid area, and therelatively thin area is the flexible area, wherein the relatively thickarea in the substrate 630 is at least twice the thicker than therelatively thin area.

In the present embodiment, the high-extensive material layer is notnecessarily patterned on the base 610, but can also be patterned firstto form the patterned high-extensive material layer 660, and then thepatterned high-extensive material layer 660 is disposed on the base 610.

In the present embodiment, the substrate board 600 includes theelectronic components 640 and 642, though the present invention is notlimited thereto, and more or less electronic components can also beincluded.

FIG. 7A to FIG. 7C are cross-sectional views illustrating a fabricationflow of a substrate board according to an embodiment of the presentinvention.

First, referring to FIG. 7A, a base material 730 is provided. Next,referring to FIG. 7B, a cutter 750, for example, a laser emitter or ablade is applied to cut a surface of the substrate 730 to form arelatively thick area and a relatively thin area thereon, so as toachieve a design of sharing the stress by different thickness. Next,electronic components 740 and 742 are fabricated on the substrate 730shown as FIG. 7C to form a substrate board 700. Wherein, the relativelythick area is the rigid area, and the relatively thin area is theflexible area, and the relatively thick area of the substrate 730 is atleast twice the thicker than the relatively thin area.

In the present embodiment, a sequence of the step of fabricating theelectronic components 740 and 742 on the substrate 730 and the step ofcutting the surface of the substrate 730 can be exchanged.

In the present embodiment, the substrate board 700 includes theelectronic components 740 and 742, though the present invention is notlimited thereto, and more or less electronic components can also beincluded.

FIG. 8A to FIG. 8D are cross-sectional views illustrating a fabricationflow of a substrate board according to an embodiment of the presentinvention.

First, referring to FIG. 8A, a base material 830 is provided. Next,referring to FIG. 8B, a cutter 850, for example, a laser emitter or ablade is applied to cut a surface of the substrate 830 to form arelatively thick area and a relatively thin area thereon, so as toachieve a design of sharing the stress by different thickness. Next,referring to FIG. 8C, a patterned high-extensive material layer 860 isformed on the cut surface of the substrate 830. A material of thepatterned high-extensive material layer 860 is, for example,polyurethane, polysiloxane, polydimethylislioxane, ether-containingmaterials series, polyolefin or combinations thereof. Next, electroniccomponents 840 and 842 are fabricated on the substrate 830 to form asubstrate board 800, as shown in FIG. 8D. Wherein, the relatively thickarea of the substrate 830 is the rigid area, and the relatively thinarea is the flexible area, and the relatively thick area is at leasttwice the thicker than the relatively thin area.

In the present embodiment, a sequence of the step of fabricating theelectronic components 840 and 842 on the substrate 830 and the step ofcutting the surface of the substrate 830 can be exchanged. Moreover, thestep of cutting the surface of the substrate 830 can be first performed,and then the step of fabricating the electronic components 840 and 842on the substrate 830 is performed. Finally, the step of disposing thepatterned high-extensive material layer 860 is performed.

In addition, in the present embodiment, the patterned high-extensivematerial layer 860 can be only disposed on the relatively thin area, soas to form a substrate board 802 shown as FIG. 10 after all fabricationsteps of the present embodiment are completed.

In the present embodiment, the substrate board 800 includes theelectronic components 840 and 842, though the present invention is notlimited thereto, and more or less electronic components can also beincluded.

FIG. 9A to FIG. 9D are cross-sectional views illustrating a fabricationflow of a substrate board according to an embodiment of the presentinvention.

First, referring to FIG. 9A, a base material 930 is provided. Next,referring to FIG. 9B, a cutter 950, for example, a laser emitter or ablade is applied to cut a surface of the substrate 930 to pierce atleast one area of the substrate 930. Next, referring to FIG. 9C, apatterned high-extensive material layer 960 is formed on the cut surfaceand the pierced area of the substrate 930. A material of the patternedhigh-extensive material layer 860 is, for example, polyurethane,polysiloxane, polydimethylislioxane, ether-containing materials series,polyolefin or combinations thereof. Next, electronic components 940 and942 are fabricated on the substrate 930 to form a substrate board 900,as shown in FIG. 9D.

In the present embodiment, a sequence of the step of fabricating theelectronic components 940 and 942 on the substrate 930 and the step ofcutting the surface of the substrate 930 can be exchanged. Moreover, thestep of cutting the surface of the substrate 930 can be first performed,and then the step of fabricating the electronic components 940 and 942on the substrate 930 is performed. Finally, the step of disposing thepatterned high-extensive material layer 960 is performed.

In the present embodiment, the substrate board 900 includes theelectronic components 940 and 942, though the present invention is notlimited thereto, and more or less electronic components can also beincluded.

FIG. 11A to FIG. 11D are respectively cross-sectional views of asubstrate board according to an embodiment of the present invention. Inthe aforementioned embodiments, the substrates 230, 330, 430, 530, 630,730, 830 and 930 can all be fabricated into shapes shown as substrates1130 a, 1130 b, 1130 c and 1130 c, wherein the stress interface can bedesigned to be progressive, such as an arc distribution, a trapezoiddistribution, a triangle distribution or a vertical distribution.

FIG. 12A and FIG. 12B are respectively a cross-sectional view of asubstrate according to an embodiment of the present invention. As shownin FIG. 12A, the substrate 1230 a has at least one relatively thick areacomposed of an area 1232 and an area 1236, and at least a relativelythin area composed of an area 1238. Since an elastic modulus of an area1234 is approximately 0, when the substrate 1230 a bears a stress, thearea 1232 can resist a deformation of the area 1236, though a resistancedegree thereof is decreased as positions thereof depart from aninterface between the area 1232 and the area 1236, so that thedeformation of the area 1236 is greater than that of the area 1232.However, as shown in FIG. 12B, if a patterned high-extensive materiallayer 1260 is disposed in the area 1234, and if the elastic modulus ofthe area 1232 is far greater than that of the patterned high-extensivematerial layer 1260, when the substrate 1230 b bears a stress, it can beregarded as four springs are applied to absorb the stress, and the area1232 and the patterned high-extensive material layer 1260 alsoparticipate the stress-absorption process, so that the deformation ofthe area 1236 can be effectively reduced.

Referring to FIG. 13, FIG. 13 is a top view of a substrate boardaccording to an embodiment of the present invention.

When electronic components are fabricated on a substrate 1330, thehigh-extensive material can be disposed at regions outside pixel areas1320 (including device areas and display areas) or outside lead areas1350 to form stress-absorption areas 1340, so that the substrate underthe pixel areas 1320 may have a relatively small deformation whenbearing the stress, and therefore a stability and lifespan of theelectronic components on the substrate can be increased.

In the present embodiment, the pixel areas, the lead areas and thestress-absorption areas respectively have a fixed number, though it isonly an example, and the present invention is not limited thereto, andthe numbers of the pixel areas, the lead areas and the stress-absorptionareas can be more or less.

FIG. 14A and FIG. 14B are respectively a top view of a substrate boardaccording to an embodiment of the present invention.

Considering a substrate board fabricated according to the fabricationmethod of the above embodiment is applied to a flexible display, whenthe electronic components are fabricated on the substrate, all of thepixel areas including all of device areas 1410 and display areas 1420can be disposed on a rigid area 1430, and all of or a part of the leadareas (not shown) can be disposed on a flexible area 1440. Wherein, thepixel areas can be arranged in alignment, as shown in FIG. 14A, or canbe arranged in interlace, as shown in FIG. 14B.

In the present embodiment, the pixel areas, the device areas, thedisplay areas, the rigid area and the flexible area respectively have afixed number, though it is only an example, and the present invention isnot limited thereto, and the numbers of the pixel areas, the deviceareas, the display areas, the rigid area and the flexible area can bemore or less.

FIG. 15A is a top view of a substrate board according to an embodimentof the present invention.

Considering a substrate board fabricated according to the fabricationmethod of the above embodiment is applied to a flexible display, whenthe electronic components are fabricated on the substrate, all of deviceareas 1510 can be disposed on a rigid area 1530, and all of displayareas 1520 and all of or a part of the lead areas (not shown) can bedisposed on flexible areas 1540. Wherein, though not illustrated in FIG.15A, a part of the display areas 1520 can also be disposed on the rigidarea 1530.

FIG. 15B is a top view of a substrate board according to an embodimentof the present invention. Moreover, the flexible areas 1540 can also besubstituted by a large-area flexible area 1542.

FIG. 15C and FIG. 15D are respectively a top view of a substrate boardaccording to an embodiment of the present invention. The pixel areas canbe disposed face to face in alignment, and all of or a part of thedisplay areas 1520 are disposed on a large-area flexible area 1544.Alternatively, as shown in FIG. 15D, the pixel areas can be disposedface to face in interlace.

In the present embodiment, the pixel areas, the device areas, thedisplay areas, the rigid area and the flexible area respectively have afixed number, though it is only an example, and the present invention isnot limited thereto, and the numbers of the pixel areas, the deviceareas, the display areas, the rigid area and the flexible area can bemore or less.

In summary, by forming the rigid area and the flexible area on thesubstrate board of the present invention, when the substrate board isbended, the flexible area may have a relatively great deformation due toits relatively weak mechanical strength, and the rigid area has arelatively small deformation, so that better characteristics of thedevice areas and display areas can be maintained. Therefore, theinfluence of the stress generated due to the deformation can be greatlyreduced.

It will be apparent to those skilled in the art that variousmodifications and variations can be made to the structure of the presentinvention without departing from the scope or spirit of the invention.In view of the foregoing, it is intended that the present inventioncover modifications and variations of this invention provided they fallwithin the scope of the following claims and their equivalents.

1. A method for fabricating a substrate board, comprising: providing asubstrate layer; patterning the substrate layer to form a substratehaving a first surface and a second surface opposite to the firstsurface and comprising at least a plurality of rigid areas and aplurality of flexible areas, wherein each of the rigid areas is thickerthan the flexible areas, and the substrate further has a plurality ofrecesses separately distributed on the second surface so as to definethe rigid areas and the flexible areas; fabricating a plurality ofelectronic components on the first surface of the substrate, wherein aportion of the electronic components located in the rigid areas arethicker than the rest of the electronic components located in theflexible areas; and forming a patterned high-extensive material layer onthe second surface of the substrate.
 2. The method for fabricating asubstrate board as claimed in claim 1, wherein patterning the substratelayer comprises: forming a patterned material layer; forming thesubstrate layer on the patterned material layer; and separating thesubstrate layer from the patterned material layer to form the rigidareas and the flexible areas on the substrate.
 3. The method forfabricating a substrate board as claimed in claim 2, wherein a materialof the material layer is an inorganic material or an organic material.4. The method for fabricating a substrate board as claimed in claim 1,wherein each of the rigid areas is at least twice the thicker than theflexible areas.
 5. The method for fabricating a substrate board asclaimed in claim 1, wherein the step of patterning the substrate layercomprises cutting a surface of the substrate layer to form the substratehaving the rigid areas and the flexible areas.
 6. The method forfabricating a substrate board as claimed in claim 5, wherein in the stepof cutting the surface of the substrate layer, a part of areas of thesubstrate layer is pierced to form holes.
 7. The method for fabricatinga substrate board as claimed in claim 1, wherein a material of thepatterned high-extensive material layer is a material selected from agroup consisting of polyurethane, polysiloxane, polydimethylislioxane,ether-containing materials series, polyolefin or combinations thereof.